Technické dokumenty
Špecifikácie
Brand
Taiwan SemiconductorBridge Type
Single Phase
Peak Average Forward Current
1.5A
Peak Reverse Repetitive Voltage
1000V
Montage-Typ
Through Hole
Package Type
WOB
Pinanzahl
4
Konfigurace
Single
Špičkový propustný nárazový proud při jednorázové špičce
40A
Maximální pracovní teplota
+125 °C
Minimum Operating Temperature
-55 °C
Peak Forward Voltage
1V
Peak Reverse Current
10µA
Länge
9.1mm
Abmessungen
9.1 x 9.1 x 5.5mm
Height
5.5mm
Breite
9.1mm
Podrobnosti o výrobku
Bridge Rectifiers - Vishay Semiconductor
The Bridge Rectifier converts an Alternating Current (AC) input into a Direct Current (DC) output for full-wave rectification applications. The diode arrangement provides the same polarity of output for either polarity of input. A three-phase full-wave rectifier is an arrangement of six diodes in a bridge circuit configuration. The packages are designed for minimal size, highest reliability and maximum thermal performance.
Informácie o zásobách sú dočasne nedostupné.
P.O.A.
Each (In a Pack of 20) (bez DPH)
20
P.O.A.
Each (In a Pack of 20) (bez DPH)
Informácie o zásobách sú dočasne nedostupné.
20
Technické dokumenty
Špecifikácie
Brand
Taiwan SemiconductorBridge Type
Single Phase
Peak Average Forward Current
1.5A
Peak Reverse Repetitive Voltage
1000V
Montage-Typ
Through Hole
Package Type
WOB
Pinanzahl
4
Konfigurace
Single
Špičkový propustný nárazový proud při jednorázové špičce
40A
Maximální pracovní teplota
+125 °C
Minimum Operating Temperature
-55 °C
Peak Forward Voltage
1V
Peak Reverse Current
10µA
Länge
9.1mm
Abmessungen
9.1 x 9.1 x 5.5mm
Height
5.5mm
Breite
9.1mm
Podrobnosti o výrobku
Bridge Rectifiers - Vishay Semiconductor
The Bridge Rectifier converts an Alternating Current (AC) input into a Direct Current (DC) output for full-wave rectification applications. The diode arrangement provides the same polarity of output for either polarity of input. A three-phase full-wave rectifier is an arrangement of six diodes in a bridge circuit configuration. The packages are designed for minimal size, highest reliability and maximum thermal performance.


