Pájecí zařízení reflow F31114 190 x 290mm s 10 programy 370 x 455 x 320mm

Forced convection reflow oven - FT31114

The FT02 forced convection reflow oven is designed to work with new, high-temperature alloys: the use of lead in such alloys will be prohibited with effect from 1 July, 2006.
For optimum accuracy, the heat is distributed by forced convection.
Standard equipment includes storage memory for 10 programmes, LCD display of instructions, and 5 connections on the front panel: 3 for soft thermocouples, 1 for a printer, and 1 for a computer.
In "Production" mode: the oven is controlled of the basis of validated and archived tests. Display of the oven probe and curve plotting.
The strong features of the FT02:
full display of the card via a large inspection window.
Useful reflow surface area of 190 x 290 mm.
Display on LCD monitor of the different instructions.
Memory storage of 10 standard programmes.
Compatible with high temperature alloys and particularly those without lead.
Heat is distributed by forced convection.
Temperature is monitored by microprocessor.
Compatible with SMTix software.®
Very simple programming for immediate user productivity.
Safety: double glass panels with air circulation, locking access door, extraction pipe for soldering fumes, filtration unit for soldering fumes available as option.

PCB Assembly Equipment