Technické Dokumenty
Špecifikácie
Brand
TranscendVelikost paměti
2TB
Typ produktu
SSD
Podtyp
SSD
Interní / Externí
Internal
Tvarový faktor
M.2
Průmyslová třída
Yes
Typ NAND
3D
Úroveň šifrování
256bitové šifrování AES
Typ rozhraní
NVMe PCIe Gen 4 x4
Betriebstemperatur min.
-20°C
Maximální pracovní teplota
75°C
Höhe
2.23mm
Länge
80mm
Normy/schválení
UKCA
Šířka
22mm
Krajina pôvodu
Taiwan, Province Of China
Podrobnosti o výrobku
This SSD is an internal storage device designed for high-performance NVMe applications in industrial settings. It connects via a PCIe Gen4 x4 Interface in an M.2 form factor and is intended for use where compact, high-capacity flash storage is required under demanding environmental conditions.
It uses the M.2 2280 footprint with a width of 22mm and a length of 80 mm, enabling Compact placement on compatible carrier boards.
The device is rated to operate up to a maximum temperature of 75°C, supporting continuous operation in thermally challenging locations.
Yes, its industrial grading and temperature tolerance make it appropriate for enclosed equipment where ambient conditions can vary.
It uses 3D NAND, which increases cell stacking for higher density and contributes to improved programme/erase endurance profiles compared with Planar NAND.
Informácie o zásobách sú dočasne nedostupné.
€ 1 867,53
€ 1 867,53 Each (bez DPH)
1
€ 1 867,53
€ 1 867,53 Each (bez DPH)
Informácie o zásobách sú dočasne nedostupné.
1
Technické Dokumenty
Špecifikácie
Brand
TranscendVelikost paměti
2TB
Typ produktu
SSD
Podtyp
SSD
Interní / Externí
Internal
Tvarový faktor
M.2
Průmyslová třída
Yes
Typ NAND
3D
Úroveň šifrování
256bitové šifrování AES
Typ rozhraní
NVMe PCIe Gen 4 x4
Betriebstemperatur min.
-20°C
Maximální pracovní teplota
75°C
Höhe
2.23mm
Länge
80mm
Normy/schválení
UKCA
Šířka
22mm
Krajina pôvodu
Taiwan, Province Of China
Podrobnosti o výrobku
This SSD is an internal storage device designed for high-performance NVMe applications in industrial settings. It connects via a PCIe Gen4 x4 Interface in an M.2 form factor and is intended for use where compact, high-capacity flash storage is required under demanding environmental conditions.
It uses the M.2 2280 footprint with a width of 22mm and a length of 80 mm, enabling Compact placement on compatible carrier boards.
The device is rated to operate up to a maximum temperature of 75°C, supporting continuous operation in thermally challenging locations.
Yes, its industrial grading and temperature tolerance make it appropriate for enclosed equipment where ambient conditions can vary.
It uses 3D NAND, which increases cell stacking for higher density and contributes to improved programme/erase endurance profiles compared with Planar NAND.