Technické Dokumenty
Špecifikácie
Brand
MolexTyp produktu
PCB Header
Řada
Micro-Fit 3.0
Rozteč
3mm
Proud
5.0
Materiál pouzdra
Thermoplastic
Počet kontaktů
2
Počet řad
2
Orientace
Right Angle
Krytý/Nekrytý
Shrouded
Konverzní jednotka svorky konektoru
Wire-to-Board
Typ montáže
Through Hole
Pokovení kontaktu
Tin
Materiál kontaktu
Brass
Betriebstemperatur min.
-40°C
Rozteč řádků
3mm
Typ zakončení
Solder
Pohlaví kontaktu
Female
Maximální pracovní teplota
105°C
Délka kontaktního kolíku
3mm
Normy/schválení
No
Napětí
250V
Podrobnosti o výrobku
Say hello to streamlined circuits with this PCB header from Molex. It lets you make multiple wire-to-board connections onto a single block. A snap-in plastic peg lock and through-hole mounting make assembly a piece of cake while ensuring the header remains firmly in place during operation. As the unit's fully shrouded, the pins are protected from accidental damage, so will last the duration.
The header withstands up to 30 mating cycles. This means you can plug and unplug it from corresponding connectors multiple times without damaging it.
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
Informácie o zásobách sú dočasne nedostupné.
€ 86,00
€ 0,86 Each (Supplied in a Bag) (bez DPH)
Výrobné balenie (Sáčok)
100
€ 86,00
€ 0,86 Each (Supplied in a Bag) (bez DPH)
Informácie o zásobách sú dočasne nedostupné.
Výrobné balenie (Sáčok)
100
| Množstvo | Jednotková cena | Sáčok |
|---|---|---|
| 100 - 370 | € 0,86 | € 4,30 |
| 375 - 1495 | € 0,824 | € 4,12 |
| 1500 - 2995 | € 0,77 | € 3,85 |
| 3000+ | € 0,74 | € 3,70 |
Technické Dokumenty
Špecifikácie
Brand
MolexTyp produktu
PCB Header
Řada
Micro-Fit 3.0
Rozteč
3mm
Proud
5.0
Materiál pouzdra
Thermoplastic
Počet kontaktů
2
Počet řad
2
Orientace
Right Angle
Krytý/Nekrytý
Shrouded
Konverzní jednotka svorky konektoru
Wire-to-Board
Typ montáže
Through Hole
Pokovení kontaktu
Tin
Materiál kontaktu
Brass
Betriebstemperatur min.
-40°C
Rozteč řádků
3mm
Typ zakončení
Solder
Pohlaví kontaktu
Female
Maximální pracovní teplota
105°C
Délka kontaktního kolíku
3mm
Normy/schválení
No
Napětí
250V
Podrobnosti o výrobku
Say hello to streamlined circuits with this PCB header from Molex. It lets you make multiple wire-to-board connections onto a single block. A snap-in plastic peg lock and through-hole mounting make assembly a piece of cake while ensuring the header remains firmly in place during operation. As the unit's fully shrouded, the pins are protected from accidental damage, so will last the duration.
The header withstands up to 30 mating cycles. This means you can plug and unplug it from corresponding connectors multiple times without damaging it.
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals