Technické Dokumenty
Špecifikácie
Brand
MolexTyp produktu
PCB Header
Řada
Micro-Fit 3.0
Rozteč
3mm
Proud
5A
Počet kontaktů
6
Materiál pouzdra
Vysokoteplotní termoplast
Počet řad
2
Orientace
Right Angle
Krytý/Nekrytý
Shrouded
Konverzní jednotka svorky konektoru
Wire-to-Board
Typ montáže
Through Hole
Materiál kontaktu
Brass
Pokovení kontaktu
Tin
Minimální provozní teplota
-40°C
Rozteč řádků
3mm
Typ zakončení
Solder
Pohlaví kontaktu
Male
Maximální provozní teplota
125°C
Délka kontaktního kolíku
3mm
Normy/schválení
NACE MR0175, ASME B16.34, API 607, ISO 5211
Napětí
250V
Podrobnosti o výrobku
Micro-Fit 3.0 3mm pitch wire to board dual row PCB through hole and SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, metal press-fit retention clips are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
Informácie o zásobách sú dočasne nedostupné.
€ 158,80
€ 1,588 Each (Supplied in a Bag) (bez DPH)
Výrobné balenie (Sáčok)
100
€ 158,80
€ 1,588 Each (Supplied in a Bag) (bez DPH)
Informácie o zásobách sú dočasne nedostupné.
Výrobné balenie (Sáčok)
100
| Množstvo | Jednotková cena | Sáčok |
|---|---|---|
| 100 - 370 | € 1,588 | € 7,94 |
| 375 - 1495 | € 1,524 | € 7,62 |
| 1500 - 2995 | € 1,154 | € 5,77 |
| 3000+ | € 1,114 | € 5,57 |
Technické Dokumenty
Špecifikácie
Brand
MolexTyp produktu
PCB Header
Řada
Micro-Fit 3.0
Rozteč
3mm
Proud
5A
Počet kontaktů
6
Materiál pouzdra
Vysokoteplotní termoplast
Počet řad
2
Orientace
Right Angle
Krytý/Nekrytý
Shrouded
Konverzní jednotka svorky konektoru
Wire-to-Board
Typ montáže
Through Hole
Materiál kontaktu
Brass
Pokovení kontaktu
Tin
Minimální provozní teplota
-40°C
Rozteč řádků
3mm
Typ zakončení
Solder
Pohlaví kontaktu
Male
Maximální provozní teplota
125°C
Délka kontaktního kolíku
3mm
Normy/schválení
NACE MR0175, ASME B16.34, API 607, ISO 5211
Napětí
250V
Podrobnosti o výrobku
Micro-Fit 3.0 3mm pitch wire to board dual row PCB through hole and SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, metal press-fit retention clips are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals