Technické Dokumenty
Špecifikácie
Brand
MolexTyp produktu
PCB Header
Řada
Micro-Fit 3.0
Rozteč
3mm
Proud
5A
Počet kontaktů
12
Materiál pouzdra
Thermoplastic
Počet řad
2
Orientace
Right Angle
Krytý/Nekrytý
Shrouded
Konverzní jednotka svorky konektoru
Wire-to-Board
Typ montáže
Surface
Materiál kontaktu
Brass
Pokovení kontaktu
Tin
Minimální provozní teplota
-40°C
Rozteč řádků
3mm
Typ zakončení
Solder
Pohlaví kontaktu
Male
Maximální provozní teplota
125°C
Délka kontaktního kolíku
3mm
Normy/schválení
NACE MR0175, ASME B16.34, API 607, ISO 5211
Napětí
250V
Podrobnosti o výrobku
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
Informácie o zásobách sú dočasne nedostupné.
€ 6,33
€ 1,266 Each (Supplied on a Reel) (bez DPH)
Výrobné balenie (Cievka)
5
€ 6,33
€ 1,266 Each (Supplied on a Reel) (bez DPH)
Informácie o zásobách sú dočasne nedostupné.
Výrobné balenie (Cievka)
5
Technické Dokumenty
Špecifikácie
Brand
MolexTyp produktu
PCB Header
Řada
Micro-Fit 3.0
Rozteč
3mm
Proud
5A
Počet kontaktů
12
Materiál pouzdra
Thermoplastic
Počet řad
2
Orientace
Right Angle
Krytý/Nekrytý
Shrouded
Konverzní jednotka svorky konektoru
Wire-to-Board
Typ montáže
Surface
Materiál kontaktu
Brass
Pokovení kontaktu
Tin
Minimální provozní teplota
-40°C
Rozteč řádků
3mm
Typ zakončení
Solder
Pohlaví kontaktu
Male
Maximální provozní teplota
125°C
Délka kontaktního kolíku
3mm
Normy/schválení
NACE MR0175, ASME B16.34, API 607, ISO 5211
Napětí
250V
Podrobnosti o výrobku
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals