Technické Dokumenty
Špecifikácie
Brand
MolexTyp produktu
PCB Header
Řada
Micro-Fit 3.0
Rozteč
3mm
Proud
5A
Počet kontaktů
6
Materiál pouzdra
Vysokoteplotní termoplast
Počet řad
1
Orientace
Right Angle
Krytý/Nekrytý
Shrouded
Konverzní jednotka svorky konektoru
Wire-to-Board
Typ montáže
Surface
Materiál kontaktu
Brass
Pokovení kontaktu
Gold
Minimální provozní teplota
-40°C
Rozteč řádků
3mm
Typ zakončení
Solder
Pohlaví kontaktu
Male
Maximální provozní teplota
125°C
Normy/schválení
NACE MR0175, ASME B16.34, API 607, ISO 5211
Napětí
250V
Krajina pôvodu
Mexico
Podrobnosti o výrobku
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
Informácie o zásobách sú dočasne nedostupné.
€ 343,40
€ 3,434 Each (Supplied on a Reel) (bez DPH)
Výrobné balenie (Cievka)
100
€ 343,40
€ 3,434 Each (Supplied on a Reel) (bez DPH)
Informácie o zásobách sú dočasne nedostupné.
Výrobné balenie (Cievka)
100
| Množstvo | Jednotková cena | Cievka |
|---|---|---|
| 100 - 370 | € 3,434 | € 17,17 |
| 375 - 1495 | € 3,34 | € 16,70 |
| 1500 - 2995 | € 3,252 | € 16,26 |
| 3000+ | € 3,172 | € 15,86 |
Technické Dokumenty
Špecifikácie
Brand
MolexTyp produktu
PCB Header
Řada
Micro-Fit 3.0
Rozteč
3mm
Proud
5A
Počet kontaktů
6
Materiál pouzdra
Vysokoteplotní termoplast
Počet řad
1
Orientace
Right Angle
Krytý/Nekrytý
Shrouded
Konverzní jednotka svorky konektoru
Wire-to-Board
Typ montáže
Surface
Materiál kontaktu
Brass
Pokovení kontaktu
Gold
Minimální provozní teplota
-40°C
Rozteč řádků
3mm
Typ zakončení
Solder
Pohlaví kontaktu
Male
Maximální provozní teplota
125°C
Normy/schválení
NACE MR0175, ASME B16.34, API 607, ISO 5211
Napětí
250V
Krajina pôvodu
Mexico
Podrobnosti o výrobku
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals