Technické Dokumenty
Špecifikácie
Brand
MolexTyp produktu
Header
Řada
71349
Rozteč
2.54mm
Proud
2.5A
Počet kontaktů
10
Materiál pouzdra
High Temperature Thermoplastic
Počet řad
2
Orientace
Vertical
Krytý/Nekrytý
Shrouded
Typ montáže
Surface Mount
Materiál kontaktu
Mosaz a fosforový bronz
Pokovení kontaktu
Tin
Betriebstemperatur min.
-40°C
Typ zakončení
Surface Mount
Maximální pracovní teplota
105°C
Normy/schválení
RoHS Compliant
Napětí
250V
Krajina pôvodu
Malaysia
Podrobnosti o výrobku
The Molex C-Grid PCB Header is expertly designed for seamless wire-to-board applications, combining robustness with a dual-row layout that enhances connectivity and signal integrity. Ideal for applications requiring high-density connections, this component features a 2.54mm pitch that ensures precise mating with compatible connectors. Engineered from high-temperature thermoplastic and with brass or phosphor bronze metal components, this header promises reliability in environments subjected to varying temperatures, with an operational range from -55°C to +105°C. Its tin plating fosters excellent conductivity, while the surface mount termination style offers a Compact footprint for space-constrained designs. In addition, the Active status indicates that this component is readily available for immediate deployment in your projects.
Informácie o zásobách sú dočasne nedostupné.
€ 734,71
€ 734,71 1 Reel of 165 (bez DPH)
1
€ 734,71
€ 734,71 1 Reel of 165 (bez DPH)
Informácie o zásobách sú dočasne nedostupné.
1
Technické Dokumenty
Špecifikácie
Brand
MolexTyp produktu
Header
Řada
71349
Rozteč
2.54mm
Proud
2.5A
Počet kontaktů
10
Materiál pouzdra
High Temperature Thermoplastic
Počet řad
2
Orientace
Vertical
Krytý/Nekrytý
Shrouded
Typ montáže
Surface Mount
Materiál kontaktu
Mosaz a fosforový bronz
Pokovení kontaktu
Tin
Betriebstemperatur min.
-40°C
Typ zakončení
Surface Mount
Maximální pracovní teplota
105°C
Normy/schválení
RoHS Compliant
Napětí
250V
Krajina pôvodu
Malaysia
Podrobnosti o výrobku
The Molex C-Grid PCB Header is expertly designed for seamless wire-to-board applications, combining robustness with a dual-row layout that enhances connectivity and signal integrity. Ideal for applications requiring high-density connections, this component features a 2.54mm pitch that ensures precise mating with compatible connectors. Engineered from high-temperature thermoplastic and with brass or phosphor bronze metal components, this header promises reliability in environments subjected to varying temperatures, with an operational range from -55°C to +105°C. Its tin plating fosters excellent conductivity, while the surface mount termination style offers a Compact footprint for space-constrained designs. In addition, the Active status indicates that this component is readily available for immediate deployment in your projects.