Technické Dokumenty
Špecifikácie
Brand
MolexPodtyp
Socket
Typ zakončení
Surface Mount
Typ produktu
Connector
Tvarový faktor
SFP
Proud
0.5A
Počet portů
1
Orientace
Vertical
Počet kontaktů
68
Materiál kontaktu
Vysoce výkonná slitina
Pohlaví konektoru
Female
Pokovení kontaktu
Gold
Napětí
30V
Materiál pouzdra
High Temperature Thermoplastic
Řada
75586
Normy/schválení
UL E29179
Krajina pôvodu
China
Podrobnosti o výrobku
The Molex Mini Multi-Lane PCI Express receptacle is a high-performance surface mount receptacle designed for optimising data transmission in contemporary applications. Featuring a Compact 0.80mm pitch, this right-angle receptacle accommodates 68 circuits, making it Ideal for high-speed I/O connectivity. With its robust construction and compatibility with various design frameworks, it is tailored for wire-to-board applications demanding excellent data rates of up to 10.0 Gbps. Notably versatile, it operates effectively within an extensive temperature range of -40° to +80°C, ensuring reliability in diverse environments. Suitable for modern electronic devices, this component is crafted from high-temperature thermoplastic, ensuring durability and longevity in demanding scenarios.
Informácie o zásobách sú dočasne nedostupné.
€ 5 572,50
€ 5 572,50 1 Reel of 550 (bez DPH)
1
€ 5 572,50
€ 5 572,50 1 Reel of 550 (bez DPH)
Informácie o zásobách sú dočasne nedostupné.
1
Technické Dokumenty
Špecifikácie
Brand
MolexPodtyp
Socket
Typ zakončení
Surface Mount
Typ produktu
Connector
Tvarový faktor
SFP
Proud
0.5A
Počet portů
1
Orientace
Vertical
Počet kontaktů
68
Materiál kontaktu
Vysoce výkonná slitina
Pohlaví konektoru
Female
Pokovení kontaktu
Gold
Napětí
30V
Materiál pouzdra
High Temperature Thermoplastic
Řada
75586
Normy/schválení
UL E29179
Krajina pôvodu
China
Podrobnosti o výrobku
The Molex Mini Multi-Lane PCI Express receptacle is a high-performance surface mount receptacle designed for optimising data transmission in contemporary applications. Featuring a Compact 0.80mm pitch, this right-angle receptacle accommodates 68 circuits, making it Ideal for high-speed I/O connectivity. With its robust construction and compatibility with various design frameworks, it is tailored for wire-to-board applications demanding excellent data rates of up to 10.0 Gbps. Notably versatile, it operates effectively within an extensive temperature range of -40° to +80°C, ensuring reliability in diverse environments. Suitable for modern electronic devices, this component is crafted from high-temperature thermoplastic, ensuring durability and longevity in demanding scenarios.