Patice PCB, řada: SEAF, orientace těla: Rovný, rozteč: 1.27 mm Deska-deska, počet kontaktů: 320, počet řad: 8, Povrch

This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.

• Up to 500 I/Os
• .050" (1.27 mm) pitch
• Rugged Edge Rate® contact
• Lower insertion/withdrawal forces
• Solder charge termination
• 7 mm - 17.5 mm stack heights
• Dual sourced by Molex®
• Samtec 28+ Gbps Solution