Technické Dokumenty
Špecifikácie
Brand
TE ConnectivityTyp produktu
Snímač vibrací
Länge
41mm
Breite
22mm
Hloubka
0.04mm
Minimální provozní teplota
0°C
Maximální pracovní teplota
70°C
Normy/schválení
No
Řada
DT
Certifikace pro nebezpečné prostory
No
Podrobnosti o výrobku
TE Connectivitys MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.
Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.
Informácie o zásobách sú dočasne nedostupné.
€ 14,60
€ 14,60 Each (bez DPH)
Štandardný
1
€ 14,60
€ 14,60 Each (bez DPH)
Informácie o zásobách sú dočasne nedostupné.
Štandardný
1
| Množstvo | Jednotková cena |
|---|---|
| 1 - 9 | € 14,60 |
| 10 - 24 | € 10,22 |
| 25 - 49 | € 9,49 |
| 50 - 99 | € 8,81 |
| 100+ | € 8,68 |
Technické Dokumenty
Špecifikácie
Brand
TE ConnectivityTyp produktu
Snímač vibrací
Länge
41mm
Breite
22mm
Hloubka
0.04mm
Minimální provozní teplota
0°C
Maximální pracovní teplota
70°C
Normy/schválení
No
Řada
DT
Certifikace pro nebezpečné prostory
No
Podrobnosti o výrobku
TE Connectivitys MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.
Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.
