SSD Interní mSATA 256 MB Průmyslová třída Transcend 3D 85 °C -40 °C

Transcend SSD, 256MB Memory size, 50.8mm Length - TS256GMSA470P

This mSATA SSD provides Compact internal storage for industrial computing and embedded systems, designed to operate in demanding environments. It connects via a SATA III 6Gb/s Interface and uses 3D NAND memory to deliver solid‑state data retention and responsiveness for automation and electronic control applications. It is specified for extended temperature ranges and conforms to UKCA standards for use in regulated installations.

Features and Benefits:

• 256MB memory size supports system buffer and caching needs
  Industrial‑grade construction enables sustained operation in harsh conditions
  Operating range from -40°C to 85°C maintains functionality across extremes
  SATA III 6Gb/s Interface delivers high‑throughput data transfer performance
  3D NAND provides dependable solid‑state storage characteristics
  mSATA form factor delivers Compact internal deployment advantages

Applications

• Suitable for industrial controllers in factory automation systems
  Ideal for embedded electronics in transportation equipment
  Used with test rigs and instrumentation requiring rugged storage
  Can be used for data logging in harsh environmental monitoring
  Used for firmware and OS storage in Compact mechanical control units

What form factor is provided for space‑constrained designs?

The drive uses an mSATA form factor intended for Compact internal installations where board‑level or small‑slot storage is required.

How does the device cope with temperature cycling in field equipment?

It is specified to operate continuously between -40°C and 85°C, supporting deployments exposed to wide thermal variation.

Which Interface should be used to connect this module?

Connect via a SATA III 6Gb/s link to host controllers or storage bridges that accept mSATA devices.

Is the product suitable for regulated UK installations?

It carries UKCA approval, indicating conformity with applicable UK regulatory marking requirements.

What NAND technology underpins the storage reliability?

The module utilises 3D NAND architecture to provide solid‑state cell layering for endurance and density.